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| Item | Capability |
| PCB Board Dimensions | 550mmX750mm |
| PCB Thickness | 0.3-8mm |
| PCB Minimum Line Width/Space | 3mil/3mil |
| SMT Component Dimensions | 008004 |
| IC Pitch | 0.3mm |
| BGA/CSP | 0.35mm |
| PCBA Complexity | Double-sided SMT placement, dispensing, through-hole insertion, crimping, heat sink mounting |
| Nitrogen Reflow Soldering / Vapor Phase Soldering | Available |
| Wave Soldering / Selective Wave Soldering | Lead-free |
| Process | Lead-free |
| BGA Inspection | 3D，X-Ray |
| BGA Rework | Available (BGA rework station, max. BGA size 70×70mm) |
| Conformal Coatin | Available |
| ICT | Available (software & hardware design and development) |
| FCT | Available (software & hardware design and development) |
| Assembly | Available |
| Packaging | Available |
| HASA | Available (-100℃ to 200℃ thermal cycle test) |
| Aging Test | Available (50℃ ±5℃) |
| Depaneling | Laser depaneling, mechanical depaneling |